Browsing by Author "Lau, S. P."

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  • Filtered cathodic vacuum arc deposition of thin film copper

    Lau, S. P.; Cheng, Y. H.; Shi, J. R.; Cao, Peng; Tay, B. K.; Shi, X. (Elsevier S.A., 2001-11)
    A major obstacle for metallization application of filtered cathodic vacuum arc (FCVA) is the presence of micro-particles. By using an off-plane double bend magnetic filter, metallic films can be deposited with relevant ...

S. P. Lau has 5 co-authors in Research Commons.