Item

Thermal stability of nanocrystalline copper films

Abstract
The grain growth kinetics of nanocrystalline copper thin film samples was investigated. The grain size of nanocrystalline copper samples was determined from the broadening of X-ray spectra. It was found that the grain size increased linearly with isothermal annealing time within the first 10 minutes, beyond which power-law growth kinetics is applied. The activation energy for grain growth was determined by constructing an Arrhenius plot, which shows an activation energy of about 21 – 30 kJ/mol. The low activation energy is attributed to the second phase particle drag and the porosity drag, which act as the pinning force for grain growth in nanocrystalline copper.
Type
Journal Article
Type of thesis
Series
Citation
Cao, P. & Zhang, D. (2006). Thermal stability of nanocrystalline copper films. International Journal of Modern Physics B, 20(25/27), 3830- 3835.
Date
2006
Publisher
World Scientific Publishing Co
Degree
Supervisors
Rights