Thermal stability of nanocrystalline copper films
Cao, P. & Zhang, D. (2006). Thermal stability of nanocrystalline copper films. International Journal of Modern Physics B, 20(25/27), 3830- 3835.
Permanent Research Commons link: https://hdl.handle.net/10289/1411
The grain growth kinetics of nanocrystalline copper thin film samples was investigated. The grain size of nanocrystalline copper samples was determined from the broadening of X-ray spectra. It was found that the grain size increased linearly with isothermal annealing time within the first 10 minutes, beyond which power-law growth kinetics is applied. The activation energy for grain growth was determined by constructing an Arrhenius plot, which shows an activation energy of about 21 – 30 kJ/mol. The low activation energy is attributed to the second phase particle drag and the porosity drag, which act as the pinning force for grain growth in nanocrystalline copper.
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